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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMichihiro SUGO, Hideto KATO, Shohei TAGAMI, Hiroyuki YASUDA, Masahito TANABE
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A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer.
A wafer processing laminate comprising a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed,
A wafer processing member comprising a support and a temporary adhesive material layer formed thereon, on the temporary adhesive material layer of which a wafer is to be temporary adhered, where the wafer has a circuit-forming front surface and a back surface to be processed,
A temporary adhering material for processing a wafer which is a material for temporary adhering the wafer to a support, where the wafer has a circuit-forming front surface and a back surface to be processed,
Dependencies are inferred from the claim text.