Computer modules with small thicknesses and associated methods of manufacturing
AssigneeMicron Technology, Inc.
InventorsKevin Gibbons, Tracy V. Reynolds, David J. Corisis
Life of this patent
Estimating the term…
Abstract
Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.
Claims3
A method for assembling a computer module, comprising:
- positioning a microelectronic package proximate to a module substrate having a module material and an aperture extending at least partially into the module material, the microelectronic package having a semiconductor die carried by a package substrate;
- generally aligning the semiconductor die of the microelectronic package with the aperture of the module substrate;
- and
- extending at least a portion of the semiconductor die into the substrate material via the aperture.
Dependencies are inferred from the claim text.