Carrier, semiconductor package and fabrication method thereof

A fabrication method of a semiconductor package, comprising the steps of:

• providing a carrier having a concave portion and a releasing layer formed on a surface thereof;
• disposing a chip on the releasing layer in the concave portion, wherein the chip has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface, the chip being disposed on the releasing layer via the active surface thereof;
• forming an encapsulant on the chip and the releasing layer;
• removing the releasing layer and the carrier so as to expose the active surface of the chip;
• and
• forming a circuit structure on the encapsulant and the active surface of the chip, wherein the circuit structure is electrically connected to the electrode pads of the chip.