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US 2014/0154840 A1Published application
Chip package and method for forming the same
AssigneeXintec Inc.
InventorsShu-Ming CHANG, Tsang-Yu LIU, Yen-Shih HO
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Abstract
An embodiment of the invention provides a chip package which includes: a first chip; a second chip disposed on the first chip; a hole extending from a surface of the first chip towards the second chip; a conducting layer disposed on the surface of the first chip and extending into the hole and electrically connected to a conducting region or a doped region in the first chip; and a support bulk disposed between the first chip and the second chip, wherein the support bulk substantially and/or completely covers a bottom of the hole.
Claims12
1-12. (canceled)
A method for forming a chip package, comprising:
- providing a first substrate;
- forming a support bulk on a surface of the first substrate;
- providing a second substrate;
- bonding the second substrate on the surface of the first substrate;
- removing a portion of the first substrate from a second surface of the first substrate to form a hole extending towards the support bulk on the first substrate, wherein the support bulk substantially and/or completely covers a bottom of the hole;
- and
- forming a conducting layer on the second surface of the first substrate, wherein the conducting layer extends into the hole to electrically connect to a conducting region or a doped region in the first substrate.
4 more elements
Dependencies are inferred from the claim text.