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US 2014/0154838 A1Published application
Mounting apparatus and mounting method
AssigneeSamsung Electronics Co., Ltd.
InventorsYukimori YOSHIAKI, Kajinami MASATO, Ueyama SHINJI
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AssigneeSamsung Electronics Co., Ltd.
InventorsYukimori YOSHIAKI, Kajinami MASATO, Ueyama SHINJI
Estimating the term…
In one embodiment the mounting apparatus mounts an upper chip on a lower chip, and thermally presses the upper chip with the lower chip. The mounting apparatus includes a first movement part for mounting the upper chip on the lower chip and preliminarily bonding by thermal pressing, and a second movement part for mainly bonding the plurality of upper chips preliminarily bonded with the plurality of lower chips for a longer time. The second movement part thermally presses the upper chips preliminarily bonded on the lower chip in a state that the upper chips are adsorbed on an adsorption surface parallel to a loading surface of the lower chip on which the upper chips are loaded.
A mounting apparatus for mounting a plurality of semiconductor chips on a connection part on a substrate and bonding the semiconductor chips with the connection part on the substrate by thermal pressing, the mounting apparatus comprising:
A mounting method for mounting a plurality of semiconductor chips on a connection part on a substrate and bonding the semiconductor chips with the connection part on the substrate by thermal pressing, the mounting method comprising:
Dependencies are inferred from the claim text.