Method and Device for processing at least one crystalline Silicon-wafer or a Solar-cell wafer
AssigneeSolarworld Innovations GmbH
InventorsMartin Kutzer, Joachim Koenig, Matthias Richter
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AssigneeSolarworld Innovations GmbH
InventorsMartin Kutzer, Joachim Koenig, Matthias Richter
Estimating the term…
In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.
A method for processing at least one crystalline silicon-wafer or a solar-cell wafer, wherein the method comprises:
A device for processing at least one crystalline silicon-wafer or a solar-cell wafer, wherein the device comprises:
Dependencies are inferred from the claim text.