Image sensor chip package and method for forming the same

A method for forming an image sensor chip package, comprising:

• providing a substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions in the substrate and each of the device regions has at least a device formed therein;
• disposing a support substrate on a first surface of the substrate;
• forming at least a spacer layer between the support substrate and the substrate, wherein the spacer layer covers the predetermined scribe lines;
• forming a package layer on a second surface of the substrate;
• forming a plurality of conducting structures on the second surface of the substrate, wherein the conducting structures are electrically connected to the corresponding device in corresponding one of the device regions, respectively;
• and
• performing a dicing process including dicing the support substrate, the spacer layer, and the substrate along the predetermined scribe lines such that the support substrate is removed from the substrate and the substrate is separated into a plurality of individual image sensor chip packages.