Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist

A photosensitive resin composition comprising:

• an (a) component:
• an acid-modified epoxy resin;
• a (b) component:
• a photopolymerizable monomer having an ethylenically unsaturated group;
• a (c) component:
• a photopolymerization initiator;
• a (d) component:
• an epoxy resin;
• and
• an (e) component:
• an inorganic filler,
• wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies at least one of the conditions shown in the following (I) and (II):
• (I) the (b) component comprises a photopolymerizable monomer having a tricyclodecane structure and a urethane bond;
• and
• (II) the (e) component comprises a silica filler having a maximum particle size of 1 μm or less in an amount of more than 60 parts by mass based on a total of 100 parts by mass of the (a) component and the (b) component.