Solid state power source with frames for attachment to an electronic circuit

A power source for a solid state device, comprising:

• a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
• a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
• first and second side encapsulant regions positioned between the first and second contact portions, and
• a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second contact portions, and between the first and second side encapsulant regions.

A power source for a solid state device, comprising:

• a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion;
• a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion;
• a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions;
• and
• an encapsulant between the first and second contact portions,
• wherein the first and second bonding portions are aligned in a first direction and the first and second contact portions are aligned in the first direction.

A device, comprising:

• a substrate having a first side and a second side;
• an electronic circuit on the first side of the substrate;
• a first frame and a second frame;
• a first side encapsulant region and a second side encapsulant region positioned between the first and second frames;
• a first battery having a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second frames, and between the first and second side encapsulant regions,
• wherein the first and second frames electrically and mechanically contact the electronic circuit on the first side of the substrate.