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US 2014/0154479 A1Published application
Resin composition for printed circuit board, insulating film, prepreg and printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsGeum Hee Yun, Jin Ho Hong, Sa Yong Lee, Jin Young Kim, Keun Yong Lee
Life of this patent
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Abstract
Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.
Claims16
A resin composition for a printed circuit board, comprising:
- a liquid crystalline oligomer;
- an epoxy resin;
- and
- an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil.
1 more element
Dependencies are inferred from the claim text.