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US 2014/0154423 A1Published application
Apparatus and method for deposition
AssigneeLG Innotek Co., Ltd.
InventorsYeong Deuk Jo, Seok Min Kang, Moo Seong Kim
Life of this patent
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Abstract
A deposition apparatus according to the embodiment includes a gas supply part for supplying a first gas; an ionization part connected to the gas supply part to supply a second gas, which is obtained by ionizing the first gas; and a reaction part into which the second gas is introduced to create a reaction. A deposition method according to the embodiment includes the steps of preparing a first gas; supplying a second gas, which is obtained by ionizing the first gas; and reacting the second gas with a substrate.
Claims12
A deposition apparatus comprising:
- a gas supply part for supplying a first gas;
- an ionization part connected to the gas supply part to supply a second gas, which is obtained by ionizing the first gas;
- and
- a reaction part into which the second gas is introduced to create a reaction.
1 more element
A deposition method comprising:
- preparing a first gas;
- supplying a second gas, which is obtained by ionizing the first gas;
- and
- reacting the second gas with a substrate.
1 more element
Dependencies are inferred from the claim text.