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US 2014/0154407 A1Published application
Polyamide-imide resin insulating coating material, insulated wire and method of making the same
AssigneeHitachi Metals, Ltd.
InventorsHideyuki KIKUCHI, Yuzo YUKIMORI
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Abstract
A polyamide-imide resin insulating coating material, which is obtained by reacting an isocyanate component with an acid component, has a main solvent component of γ-butyrolactone. In the coating material, a total compounding ratio of 4,4′-diphenylmethane diisocyanate (MDI) and trimellitic anhydride (TMA) is 85 to 98 mol %, where the total compounding ratio is given by averaging a compounding ratio of MDI to the isocyanate component and a compounding ration of TMA to the acid component.
Claims12
A polyamide-imide resin insulating coating material, comprising:
- a polyamide-imide resin obtained by reacting, in a mixed solvent, an isocyanate component comprising (i) 4,4′-diphenylmethane diisocyanate and (ii) an isomer of 4,4′-diphenylmethane diisocyanate other than 4,4′-diphenylmethane diisocyanate, with an acid component comprising a trimellitic anhydride, wherein:
- a total compounding ratio, obtained by averaging the compounding ratio of the 4,4′-diphenylmethane diisocyanate in the isocyanate components and the compounding ratio of the trimellitic anhydride in the acid components, is in the range of 85 to 98 mol %;
- and
- the mixed solvent comprises ybutyrolactone as a main solvent and at least one nitrogen-containing high boiling point polar solvent selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), and N,N-dimethylacetamide (DMAC).
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A method of making a polyamide-imide resin insulating coating material, comprising:
- reacting an isocyanate component comprising (i) 4,4′-diphenylmethane diisocyanate and (ii) an isomer of 4,4′-diphenylmethane diisocyanate other than 4,4′-diphenylmethane diisocyanate, with an acid component comprising a trimellitic anhydride by using a mixed solvent comprising γ-butyrolactone as a main solvent and at least one nitrogen-containing high boiling point polar solvent selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), and N,N-dimethylacetamide (DMAC) to synthesize the polyamide-imide resin insulating coating material,
- wherein a total compounding ratio, obtained by averaging the compounding ratio of the 4,4′-diphenylmethane diisocyanate in the isocyanate components and the compounding ratio of the trimellitic anhydride in the acid components, is in the range of 85 to 98 mol %.
A method of making an insulated wire, comprising:
- preparing a polyamide-imide resin insulating coating material by reacting an isocyanate component comprising (i) 4,4′-diphenylmethane diisocyanate and (ii) an isomer of 4,4′-diphenylrnethane diisocyanate other than 4,4′-diphenylrnethane diisocyanate, with an acid component comprising a trimellitic anhydride by using a mixed solvent comprising γ-butyrolactone as a main solvent and at least one nitrogen-containing high boiling point polar solvent selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), and N,N-dimethylacetamide (DMAC) to synthesize the polyamide-imide resin insulating coating material,
- wherein a total compounding ratio, obtained by averaging the compounding ratio of the 4,4′-diphenylmethane diisocyanate in the isocyanate components and the compounding ratio of the trimellitic anhydride in the acid components, is in the range of 85 to 98 mol %;
- and
- coating the polyamide-imide resin insulating coating material on a conductor, and then baking the polyamide-imide resin insulating coating material to form a coating film on the conductor.
1 more element
A method of making an insulated wire, comprising:
- preparing a polyamide-imide resin insulating coating material by reacting an isocyanate component comprising (i) 4,4′-diphenylmethane diisocyanate and (ii) an isomer of 4,4′-diphenylmethane diisocyanate other than 4J4′-diphenylmethane diisocyanate, with an acid component comprising a trimellitic anhydride by using a mixed solvent comprising γ-butyrolactone as a main solvent and at least one nitrogen-containing high boiling point polar solvent selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), and N,N-dimethylacetamide (DMAC) to synthesize the polyamide-imide resin insulating coating material,
- wherein a total compounding ratio defined by averaging the compounding ratio of the 4,4′-diphenylmethane diisocyanate in the isocyanate components and trimellitic anhydride in the acid components is in the range of 85 to 98 mol %, where the compounding ratio is given by averaging a compounding ratio of the MDI to the isocyanate component and a compounding ratio of the TMA to the acid component;
- forming an organic insulation coating layer on the surface of a conductor, and
- coating the polyamide-imide resin insulating coating material on the organic insulation coating layer, and then baking the polyamide-imide resin insulating coating material to form a coating film on the organic insulation coating layer.
1 more element
Dependencies are inferred from the claim text.