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US 2014/0154037 A1Published application
Method and systems for semiconductor chip pick & transfer and bonding
AssigneeOrion Systems Integration Pte Ltd
InventorAmlan Sen
Life of this patent
Estimating the term…
Abstract
Various embodiments provide a system for pick and transfer of semiconductor chips. The system comprises: a rotating arm; two pick up heads attached at respective end portions of the rotating arm; and a camera system for inspecting a chip pick-up position in a vertical line of sight configuration. Also, an axis of rotation of the rotating arm is offset from the line of sight. Various embodiments also provide a corresponding method.
Claims8
A system for pick and transfer of semiconductor chips comprising:
- a rotating arm;
- two pick up heads attached at respective end portions of the rotating arm;
- and
- a camera system for inspecting a chip pick-up position in a vertical line of sight configuration;
- wherein an axis of rotation of the rotating arm is offset from the line of sight.
2 more elements
A method for pick and transfer of semiconductor chips, the method comprising:
- providing a rotating arm;
- providing two pick up heads attached at respective end portions of the rotating arm;
- providing a camera system for inspecting a chip pick-up position in a vertical line of sight configuration;
- and
- rotating the rotating arm for pick and transfer of the semiconductor chips, wherein an axis of rotation of the rotating arm is offset from the line of sight.
2 more elements
-56. (canceled)
Dependencies are inferred from the claim text.