Calibrating thermal behavior of electronics
AssigneeInternational Business Machines Corporation
InventorsTimothy J. Chainer, Pritish R. Parida, Mark D. Schultz
Life of this patent
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Abstract
A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
Claims18
A method comprising the steps of:
- determining a relationship between indirect thermal data for at least a first processor and a measured temperature associated with said at least first processor, during a calibration process;
- obtaining said indirect thermal data for said at least first processor during actual operation of said at least first processor;
- and
- determining an actual significant temperature associated with said at least first processor during said actual operation using said indirect thermal data for said at least first processor during actual operation of said at least first processor and said relationship.
A calibration method for a component dissipating heat into a coolant cooled apparatus, the method comprising:
- determining a heat dissipation of said component;
- determining a thermal resistance from said component to a coolant;
- determining a measured temperature of said component according to said heat dissipation and said thermal resistance at a plurality of time stamps included in thermal data output by said component;
- and
- determining a relationship between said measured temperature and said thermal data for said component.
Dependencies are inferred from the claim text.