US 2014/0153210 A1 · ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

Abstract

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

Claims53

Dependent claims

A microelectronic assembly, comprising:

a first substrate having a surface and a first conductive element;
a second substrate having a surface and a second conductive element;
and
an electrically conductive alloy mass joined to the first and second conductive elements, wherein the conductive alloy mass includes a first material, a second material, and a third material, the third material selected to increase the melting point of an alloy including the third material and at least one of the first material or the second material, wherein a concentration of the first material varies from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and wherein a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

1 more element

Dependencies are inferred from the claim text.

Advanced device assembly structures and methods

Life of this patent

Advanced device assembly structures and methods

Life of this patent

Abstract

Claims53