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US 2014/0153208 A1Published application
Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device
AssigneeLG Display Co., Ltd.
InventorsYeo-O YOUN, Dong-Sik PARK, Jeong-Beom PARK, Hye-Sun SONG, A-Ram SOHN
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Abstract
The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
Claims18
An adhesive material for an electrical connection, comprising:
- a base resin;
- an ionic optical-curing agent;
- an optical curing accelerant;
- and
- a conductive particle having a size of several to several tens nanometers,
- wherein the adhesive film is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
3 more elements
A display device, comprising:
- a display panel including an array substrate and a color filter substrate;
- a pad electrode in a non-display region of the array substrate;
- an adhesive layer on the pad electrode and including:
- a base resin;
- an ionic optical-curing agent;
- an optical curing accelerant;
- and
- a conductive particle having a size of several to several tens nanometers, and
- a drive IC on the adhesive layer and electrically connected to the pad electrode through the adhesive layer,
- wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
7 more elements
A method of fabricating a display device, comprising:
- forming a display panel including an array substrate and a color filter substrate, wherein a pad electrode is formed in a non-display region of the array substrate;
- forming an adhesive layer on the pad electrode by coating an adhesive material, the adhesive material including:
- a base resin;
- an ionic optical-curing agent;
- an optical curing accelerant;
- and
- a conductive particle having a size of several to several tens nanometers, disposing a drive IC on the adhesive layer;
- irradiating a UV light onto the adhesive layer through a rear surface of the array substrate;
- and
- pressing the drive IC toward the adhesive layer,
- wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant, and wherein the UV light is diffused by the optical curing accelerant into a portion of the adhesive layer shielded by the pad electrode.
8 more elements
Dependencies are inferred from the claim text.