Systems and methods for embedding devices in printed circuit board structures
AssigneeInfineon Technologies Austria AG
InventorsMartin Standing, Andrew Roberts
Life of this patent
Estimating the term…
Abstract
Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes.
Claims27
An insert configured to be embedded in a multi-layer printed circuit board (PCB) that comprises a first layer, a second layer that includes an aperture, and at least a third layer arranged above the second layer, the insert comprising:
- a semiconductor die arranged at a surface of the insert, wherein the semiconductor die includes at least one pad that is configured to be electrically coupled with to create an electrical connection to at least one circuit of the semiconductor die from external to the semiconductor die;
- and
- at least one extender portion that extends a distance along the surface of the insert from the pad to a coupling element with a surface area substantially greater than a surface area of the at least one pad of the semiconductor die, and wherein the coupling element is configured to be electrically coupled with from external to the second layer through an opening in one or more of the first layer and the third layer.
A printed circuit board (PCB) comprising:
- a first layer;
- a second layer that includes an aperture, wherein the aperture is sized, shaped, and arranged to receive an insert that is configured to be disposed in the aperture in the second layer, wherein the insert comprises:
- a semiconductor die arranged at a surface of the insert, wherein the semiconductor die includes at least one pad that is configured to be electrically coupled with to create an electrical connection to at least one circuit of the semiconductor die from external to the semiconductor die, and
- at least one extender portion that extends a distance spaced apart along the surface of the insert from the pad to a coupling element with a surface area substantially greater than a surface area of the at least one pad of the semiconductor die;
- and
- wherein the PCB further comprises at least one third layer arranged upon the second layer to substantially enclose the semiconductor die within the aperture;
- and
- wherein the coupling element is configured to be electrically coupled to from external to the second layer through an opening formed in one or more of the first layer and the third layer.
A printed circuit board (PCB) comprising:
- a plurality of layers coupled to form a stack, wherein at least one layer of the plurality of layers comprises an aperture;
- an insert comprising a die and at least one coupling element spaced apart from the die, the insert configured to be disposed in the aperture;
- and
- at least one via formed through the plurality of layers and the at least one coupling element to electrically couple the insert with at least one of the plurality of layers other than the at least one layer comprising the aperture.
A method of forming a printed circuit board (PCB) stack comprising:
- forming an insert comprising
- a semiconductor die arranged at a surface of the insert, wherein the semiconductor die includes at least one pad that is configured to be electrically coupled with to create an electrical connection to at least one circuit of the semiconductor die from external to the semiconductor die, and
- at least one extender portion that extends a distance along the surface of the insert from the pad to a coupling element with a surface area substantially greater than a surface area of the at least one pad of the semiconductor die;
- forming a first layer comprising an aperture;
- arranging the insert in the aperture;
- arranging at least one additional layer with the first layer to form a stack;
- and
- electrically coupling with the coupling element of the insert from external to the first layer of the stack through an opening in one or more of the at least one additional layers.
Dependencies are inferred from the claim text.