Wiring board and method for manufacturing the same

A method for manufacturing a wiring board, comprising:

• forming in a substrate an opening portion which accommodates a plurality of electronic device and which is defined by a wall surface configured such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other;
• positioning a plurality of electronic devices in the opening portion such that the electronic devices are kept from making contact with each other by the wall surface and that the electronic devices are arrayed in a lateral direction of each of the electronic devices;
• and
• forming an insulation layer on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate.