Electronic component embedded printing circuit board and method for manufacturing the same

A method for manufacturing an electronic component embedded printed circuit board, comprising:

• forming a through hole-shaped cavity in a core and attaching a carrier to a lower surface of the core;
• inserting an electronic component having a bonding coating layer on an outer peripheral surface in the cavity;
• forming an upper insulating layer on the core in which the electronic component is embedded;
• removing the carrier attached to the lower surface of the core;
• forming a lower insulating layer on an opposite surface of the core on which the upper insulating layer is formed;
• and
• forming circuit patterns on the upper and lower insulating layers to be electrically connected to the electronic component through a via.

A method for manufacturing an electronic component embedded printed circuit board, comprising:

• forming a through hole-shaped cavity in a core and attaching a carrier to a lower surface of the core;
• inserting an electronic component in the cavity;
• forming a bonding coating layer on the electronic component inserted in the cavity;
• forming an upper insulating layer on the core in which the electronic component is embedded in the cavity;
• removing the carrier attached to the lower surface of the core;
• forming the bonding coating layer on a surface of the electronic component exposed on the cavity of the core, where the bonding coating layer is not formed;
• forming a lower insulating layer on an opposite surface of the core on which the upper insulating layer is formed;
• and
• forming circuit patterns on the upper and lower insulating layers to be electrically connected to the electronic component through a via.