Mounting structure of chip component and electronic module using the same

A mounting structure of a chip component, comprising:

• a circuit board;
• a plurality of chip components surface-mounted on the circuit board;
• solders that electrically connect the chip components and the circuit board;
• and
• a mold member that seals the chip components, wherein
• the circuit board includes a wiring layer including a plurality of lands and a solder resist layer that selectively covers the wiring layer,
• the solder resist layer includes resist patterns that partially covers the lands,
• each of the chip components includes a bottom electrode parallel to a surface of the circuit board and a side electrode perpendicular to the surface of the circuit board,
• each of the solders electrically connects the bottom electrode and the side electrode and an exposed portion of the land,
• each of the resist patterns has an overlapped portion overlapped with the bottom electrode in a planar view,
• each of the solders has a first solder portion adhered to the side electrode and a second solder portion between the bottom electrode and the exposed portion of the land, and
• at least a first gap between the resist pattern and the first solder portion is the filled with the mold member.