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US 2014/0153193 A1Published application
Phase change heat sink for transient thermal management
AssigneeGE Aviation Systems LLC
InventorsMichel Engelhardt, Paul Otto Stehlik, Lawrence Joseph Hannaford, JR.
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Abstract
A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.
Claims23
A heat dissipating assembly, comprising:
- at least one heat producing component;
- and
- a heat sink having phase change material conductively coupled to the at least one heat producing component;
- wherein in the phase change material changes between at least two phases in response to a conductive transfer of heat from the heat producing component to the phase change material.
1 more element
A clamshell assembly for a printed circuit board (PCB) having at least one heat producing component, comprising:
- an upper thermal plane;
- a lower thermal plane spaced from the upper thermal plane to partially define a PCB chamber for holding the PCB;
- and
- a heat sink with a phase change material mounted to one of the upper thermal plane and the lower thermal plane.
1 more element
Dependencies are inferred from the claim text.