Glass system for hermetically joining cu components, and housing for electronic components
AssigneeSchott AG
InventorsRobert Hettler, Matthias Rindt
Life of this patent
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Abstract
An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.
Claims30
1-28. (canceled)
An housing for accommodating an electronic functional element, comprising:
- a base body made of metal and having an upper surface that at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element, the base body having a lower surface and a lateral surface;
- and
- at least one connecting body made of metal that is joined to the base body at least by one glass layer, wherein the at least one glass layer is formed by an alkali titanium silicate glass.
An housing for accommodating an electronic functional element, comprising:
- a base body made of metal and having an upper surface that at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element, the base body having a lower surface, a lateral surface, and at least one channel;
- at least one connecting body made of metal arranged in the at least one channel;
- and
- glass at least partially filling the at least one channel to join the base body to the at least one connecting body.
A method for producing an optoelectronic functional element housing, comprising:
- providing at least one base body including at least one channel and having an upper surface that at least partially defines a mounting area for the optoelectronic functional element so that the base body forms a heat sink for the optoelectronic functional element;
- providing at least one connecting body for the optoelectronic functional element and glass for joining the at least one connecting body to the base body within the at least one channel;
- heating the glass in the at least one channel to a viscosity at which it adheres such that a composite is formed from the base body and the at least one connecting body;
- and
- cooling the glass so that the base body and the at least one connecting body form a material bond, wherein at least portions of the at least one connecting body are embedded in the glass.
Dependencies are inferred from the claim text.