Measuring apparatus, imprint system, measuring method, and device manufacturing method

An imprint system comprising:

• an imprint apparatus for forming a pattern on a substrate using a mold;
• and
• a measuring apparatus for obtaining a thickness of a residual layer in a recessed portion of the pattern formed by the imprint apparatus,
• wherein the measuring apparatus obtains, based on a characteristic of each of beams of reflected light obtained by irradiating with light a pattern formed by the imprint apparatus, a thickness of a residual layer in a recessed portion of the pattern formed by the imprint apparatus, the measuring apparatus comprising:
• a storage unit configured to store a relationship, regarding an irradiation condition based on a correlation between a characteristic of reflected light from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern;
• and
• a processing unit configured to, based on a characteristic of the reflected light from the pattern formed by the imprint apparatus on the substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain the thickness of the residual layer in the recessed portion of the pattern formed by the imprint apparatus.

A device manufacturing method comprising:

• forming a pattern on a substrate using an imprint system;
• and
• processing the substrate on which the pattern has been formed,
• wherein the imprint system comprising:
• an imprint apparatus for forming a pattern on a substrate using a mold;
• and
• a measuring apparatus for obtaining a thickness of a residual layer in a recessed portion of the pattern formed by the imprint apparatus,
• wherein the measuring apparatus obtains, based on a characteristic of each of beams of reflected light obtained by irradiating with light a pattern formed by the imprint apparatus, a thickness of a residual layer in a recessed portion of the pattern formed by the imprint apparatus, the measuring apparatus comprising:
• a storage unit configured to store a relationship, regarding an irradiation condition based on a correlation between a characteristic of reflected light from a plurality of patterns different from one another in a thickness of a residual layer in a recessed portion and the thickness of the residual layer of each of the plurality of patterns, between the characteristic of the reflected light from each pattern and the thickness of the residual layer of the pattern;
• and
• a processing unit configured to, based on a characteristic of the reflected light from the pattern formed by the imprint apparatus on the substrate irradiated with light under the irradiation condition and the relationship stored in the storage unit, obtain the thickness of the residual layer in the recessed portion of the pattern formed by the imprint apparatus.