Apparatus for detecting the flatness of wafer and the method thereof
AssigneeShanghai Huali Microelectronics Corporation
InventorsWenLiang Li, LiJun Chen, Jun Zhu, HsuSheng Chang
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AssigneeShanghai Huali Microelectronics Corporation
InventorsWenLiang Li, LiJun Chen, Jun Zhu, HsuSheng Chang
Estimating the term…
An apparatus for detecting the flatness of a top surface of a wafer includes a plurality of detector elements, a metal sink and a plurality of injection pipes. Each detector element comprises: a metal tube body, jet pipes, a light receiver and a light emitter. The method comprises: injecting ultra-pure water into the detector elements by injection pipes; emitting parallel beams along an upward-oblique direction, a preset Angle θ being formed between the beams and the vertical direction. The radiated beams above the water surface are incident on a receiver. The intensity of the beams received by the light receiver is used to calculate the height of the detecting point of the surface of the silicon wafer to determine the flatness condition of the wafer surface. The flatness of the photo-resist covered on the wafer surface can also be accurately measured by this method.
An apparatus for detecting the flatness of wafer, wherein the apparatus comprises a plurality of detector elements, a metal sink and a plurality of injection pipes, the detector elements arranged side by side together make up a one-row detector elements;
Dependencies are inferred from the claim text.