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US 2014/0152881 A1Published application
Solid-state imaging device, manufacturing method thereof, and camera with alternately arranged pixel combinations
AssigneeSony Corporation
InventorsHiroaki Ishiwata, Sanghoon Ha
Life of this patent
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Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Claims22
A solid-state imaging device, comprising:
- a semiconductor substrate;
- and
- a pixel unit having a plurality of pixels on the semiconductor substrate,
- wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups,
- wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
2 more elements
A solid-state imaging system comprising:
- a solid-state imaging device in which a plurality of pixels are integrated on a light sensing surface;
- an optical system which guides incident light to an imaging unit of the solid-state imaging device;
- and
- a signal processing circuit which processes output signals of the solid-state imaging device,
- wherein the solid-state imaging device includes:
- a semiconductor substrate;
- and
- a pixel unit having a plurality of pixels on the semiconductor substrate,
- wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups,
- wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
7 more elements
Dependencies are inferred from the claim text.