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US 2014/0152509 A1Published application
Embedding Low-K Materials in Antennas
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMonsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang
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Abstract
A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.
Claims20
A device comprising:
- a patch antenna comprising:
- a feeding line;
- a ground panel over the feeding line, wherein the ground panel comprises an aperture therein;
- a low-k dielectric module over and aligned to the aperture;
- and
- a patch over the low-k dielectric module.
3 more elements
A device comprising:
- a device die;
- a molding material, with the device die molded therein;
- and
- a patch antenna comprising:
- a patch;
- a ground panel, wherein the patch and the ground panel are on opposite sides of the molding material;
- and
- a feeding line electrically coupled to the device die.
5 more elements
A method comprising:
- placing a device die and a low-k dielectric module over a first carrier;
- molding the device die and the low-k dielectric module in a molding material;
- forming a ground panel of a patch antenna overlying the molding material;
- forming a feeding line of the patch antenna overlying the ground panel, wherein the feeding line is electrically coupled to the device die;
- and
- forming a patch of the patch antenna underlying the low-k dielectric module.
3 more elements
Dependencies are inferred from the claim text.