Systems and methods for distributing power to integrated circuit dies

A method for distributing power to a plurality of integrated circuit dies, the method comprising:

• providing a plurality of integrated circuit dies disposed on a substrate, wherein each of the plurality of integrated circuit dies comprises a circuit and a target inductive element coupled to the circuit;
• generating, by a power supply module, a source power signal;
• and
• electromagnetically coupling, using at least one source inductive element, the source power signal to one or more of the plurality of the target inductive elements to generate one or more target power signals that supply power to one or more corresponding circuits.

A system for distributing power to a plurality of integrated circuit dies, the system comprising:

• a substrate comprising at least one source inductive element;
• a plurality of integrated circuit dies disposed on the substrate, wherein each of the plurality of integrated circuit dies comprises a circuit and a target inductive element coupled to the circuit;
• a power supply module configured to generate a source power signal;
• and
• at least one switch configured to select a set of the plurality of integrated circuit dies,
• wherein the at least one source inductive element is configured to electromagnetically couple the source power signal to a set of target inductive elements corresponding to the selected set of integrated circuit dies to generate one or more target power signals that supply power to a set of corresponding circuits.