Integrated Circuits Including Magnetic Devices, And Associated Methods

An integrated circuit, comprising:

• a semiconductor die including one or more switching circuits;
• a magnetic core;
• a plurality of metallic leads wound through the magnetic core, at least one of the leads being electrically coupled to the semiconductor die;
• and
• integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and a portion of the plurality of metallic leads, to form an integrated circuit package;
• the plurality of metallic leads being electrically isolated from each other within the integrated circuit package.

An integrated circuit, comprising:

• a semiconductor die including one or more switching circuits;
• a magnetic core having length and width;
• a first metallic lead forming a first winding turn around a portion of the magnetic core, the first metallic lead being electrically coupled to the semiconductor die;
• a second metallic lead forming a second winding turn around a portion of the magnetic core;
• and
• integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and portions of the first and second metallic leads, to form an integrated circuit package;
• the first and second winding turns being offset from each other along both of the width and length of the magnetic core.

An integrated circuit, comprising:

• a semiconductor die including one or more switching circuits;
• a magnetic core having length and width;
• first and second lead sets, each lead set including a plurality of metallic leads, each metallic lead wound around a portion of the magnetic core in the lengthwise direction of the magnetic core, at least one of the plurality of metallic leads being electrically coupled to the semiconductor die;
• and
• integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and a portion of the first and second lead sets, to form an integrated circuit package;
• the first and second lead sets non-overlapping and separated by a first separation distance, along the width of the magnetic core;
• the first separation distance being greater than each separation distance between adjacent metallic leads of the first and second lead sets, along the width of the magnetic core.

An integrated electronic assembly, comprising:

• a substrate including a cut-out portion;
• first and second semiconductor dies disposed on the substrate, the first semiconductor die including one or more switching circuits;
• an inductor including a magnetic core extending at least partially into the cut-out portion of the substrate;
• metallic connection circuitry electrically coupling the first and second semiconductor dies and the inductor;
• and
• packaging material encapsulating at least a portion of the substrate, the first and second semiconductor dies, the inductor, and the metallic connection circuitry, to form an assembly package.

An integrated electronic assembly, comprising:

• a substrate;
• first and second semiconductor dies disposed on the substrate, the first semiconductor die including one or more switching circuits;
• a heat sink plate disposed on the first and second semiconductor dies, the heat sink plate including a cut-out portion;
• an inductor including a magnetic core disposed on the substrate and extending at least partially into the cut-out portion of the heat sink plate;
• metallic connection circuitry electrically coupling the first and second semiconductor dies and the inductor;
• and
• packaging material encapsulating at least part of the substrate, the first and second semiconductor dies, the inductor, and the first metallic connection circuitry, to form an assembly package.

An integrated electronic assembly, comprising:

• a substrate;
• and
• an integrated circuit disposed on the substrate, the integrated circuit including:
• a first semiconductor die including one or more switching circuits,
• a magnetic core, and
• a metallic lead wrapped around at least a portion of the magnetic core, the metallic lead having a first end connected to the semiconductor die and a second end, opposite of the first end, connected to the substrate.

An integrated electronic assembly, comprising:

• a substrate;
• and
• an integrated circuit disposed on the substrate, the integrated circuit including:
• a first semiconductor die including one or more switching circuits,
• a magnetic core having length and width,
• a first metallic lead forming a first winding turn around a portion of the magnetic core, the first metallic lead being electrically coupled to the semiconductor die, and
• a second metallic lead forming a second winding turn around a portion of the magnetic core,
• the first and second winding turns being offset from each other along both of the width and length of the magnetic core.

An integrated electronic assembly, comprising:

• a substrate including conductive traces;
• and
• an integrated circuit disposed on the substrate, the integrated circuit including:
• a first semiconductor die including one or more switching circuits,
• a magnetic core having length and width, and
• first and second windings electrically coupled to the first semiconductor die, each winding including a plurality of metallic leads electrically coupled in series by the conductive traces of the substrate, each metallic lead wound around a portion of the magnetic core in a lengthwise direction of the magnetic core,
• wherein the first and second windings are non-overlapping and separated by a first separation distance, along the width of the magnetic core, and
• wherein the first separation distance is greater than each separation distance between adjacent metallic leads of the first and second windings, along the width of the magnetic core.

A method for manufacturing an integrated circuit including a magnetic device, comprising:

• separately manufacturing a main portion of the integrated circuit and a magnetic portion of the integrated circuit, the main portion including a semiconductor die attached to a lead frame, and the magnetic portion including a magnetic core and at least one metallic lead wound on or through the magnetic core;
• joining the main and magnetic portions of the integrated circuit to form one or more windings, the one or more windings including at least a portion of the lead frame and the at least one lead wound on or through the magnetic core;
• and
• after the step of joining, packaging the main and magnetic portions of the integrated circuit.