Method for manufacturing semiconductor device, semiconductor device and jig for forming wiring

Abstract

A method for manufacturing a semiconductor device includes: forming a structure including a substrate, a device layer formed on the substrate, a pair of through-hole electrodes penetrating through the substrate in the thickness direction of the substrate, a pair of vertical electrodes extending in the thickness direction of the substrate and reaching to one surface of the substrate, and a shared wiring connecting the pair of vertical electrodes in the device layer; forming a connection wiring connecting one of the through-hole electrodes and one of the vertical electrodes; and stacking the structure and a second substrate such that an electrode of the second substrate is connected to a through-hole electrode which is not connected to the connection wiring among the pair of through-hole electrodes.

Dependencies are inferred from the claim text.