Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKyung Don Mun
Life of this patent
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Abstract
Disclosed herein are a printed circuit board, including an insulating layer; a circuit wiring formed on one surface or both surfaces of the insulating layer and made of a single metal layer; a via formed in the insulating layer for interconnecting the circuit wirings through the insulating layer; and a pad layer formed on one surface or both surfaces of the insulating layer and adhered to an end portion of the via, the pad layer being formed of a central portion extended from the via and an outside portion made of the same single metal layer as the circuit wiring, and a method for manufacturing the same.
Claims10
A printed circuit board, comprising:
- an insulating layer;
- a circuit wiring formed on one surface or both surfaces of the insulating layer and made of a single metal layer;
- a via formed in the insulating layer for interconnecting the circuit wirings through the insulating layer;
- and
- a pad layer formed on one surface or both surfaces of the insulating layer and adhered to an end portion of the via,
- wherein the pad layer is formed of a central portion extended from the via and an outside portion made of the same single metal layer as the circuit wiring.
A method for manufacturing a printed circuit board, the method comprising:
- (a) preparing an insulating layer having a single metal layer adhered to one surface or both surfaces thereof;
- (b) processing a via hole in the insulating layer;
- (c) forming a plating layer in the via hole as well as on a surface of the single metal layer;
- (d) polishing an upper surface of the single metal layer at a predetermined thickness so as to expose the surface of the single metal layer;
- and
- (e) selectively etching the single metal layer to form a circuit wiring and a pad layer.
Dependencies are inferred from the claim text.