Semiconductor package

A semiconductor package comprising:

• a first wiring substrate;
• a first spacer on the first wiring substrate, wherein the first spacer has a rectangular shape having opposed short sides and opposed long sides;
• a second spacer on the first wiring substrate to be separated from the first spacer, wherein the second spacer has a rectangular shape having opposed short sides and opposed long sides;
• a second wiring substrate on the first spacer and the second spacer and comprising a first surface and a second surface which is opposite to the first surface and faces the first and second spacers, wherein the second wiring substrate has opposed sides;
• a first semiconductor chip on the first surface of the second wiring substrate;
• and
• a second semiconductor chip on the second surface of the second wiring substrate to be disposed between the first spacer and the second spacer, and
• wherein the opposed long sides of the first spacer and the opposed long sides of the second spacer are substantially parallel with the opposed sides of the second wiring substrate.