Package with a fan-out structure and method of forming the same

A method of forming a semiconductor device comprising:

• forming a die,
• attaching the die over a dicing tape with an adhesive layer;
• singulating the die;
• de-bonding the die from the dicing tape;
• attaching the die over a carrier with the adhesive layer, wherein the adhesive layer is coterminous with the die;
• molding the die with a polymer, wherein the polymer encircles the die and the adhesive layer;
• forming a connector over and aligned to the polymer, wherein the connector is electrically coupled to the die;
• de-bonding the die from the carrier;
• bonding a coating tape to the die on a side opposite the connector;
• and
• singulating the die with the connector to form the semiconductor device.

A method of forming a semiconductor device comprising:

• forming at least two dies on a substrate;
• affixing the at least two dies to a dicing tape with a glue layer;
• singulating the at least two dies;
• affixing the at least two dies to a carrier substrate with the glue layer, wherein the at least two dies have a separate glue layer between the carrier substrate and the at least two dies, and wherein the separate glue layer is substantially aligned with the at least two dies;
• encapsulating the at least two dies with a molding compound, wherein a portion of the molding compound extends from a first die of the at least two dies to a second die of the at least two dies;
• and
• planarizing top surfaces of the molding compound and the at least two dies, wherein the top surfaces of the portion of the molding compound and the at least two dies are substantially level, the top surface of the portion of the molding compound being a continuous material from the first die to the second die.

A method of forming a semiconductor device comprising:

• forming a die;
• affixing the die to a dicing tape with a glue layer;
• singulating the die;
• affixing the die to a carrier with the glue layer;
• encapsulating the die with a molding compound, wherein the molding compound encircles the die and the glue layer;
• de-bonding the die from the carrier;
• and
• bonding a coating tape to the glue layer and the molding compound.