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US 2014/0151883 A1Published application
Method for manufacturing a semiconductor component and structure therefor
AssigneeSemiconductor Components Industries, LLC
InventorsPhillip Celaya, James P. Letterman, JR., Robert L. Marquis
Life of this patent
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Abstract
A semiconductor component having wettable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components.
Claims20
A method for manufacturing a semiconductor component, comprising:
- providing a leadframe partially embedded in a mold compound, the leadframe having a first major surface and a second major surface opposite the first major surface, the leadframe comprising a plurality of flags, a plurality of leads, and a tiebar, and wherein a semiconductor device is coupled to the first major surface of a first flag;
- exposing a first edge, the first edge extending from the second major surface a first distance toward the first major surface, wherein the first distance is less than the thickness of the leadframe and greater than fifty percent of the thickness of the leadframe;
- forming a first material over a portion of the first edge;
- separating the leadframe into at least two portions;
- and
- separating the mold compound into at least two portions.
3 more elements
A semiconductor component, comprising:
- a semiconductor device coupled to an electrical interconnect structure, wherein the semiconductor device is embedded in a mold compound and the electrical interconnect structure is partially embedded in the mold compound, and wherein the electrical interconnect structure comprises a plurality of leads, each lead having an outer edge;
- and
- a first material over a portion of the outer edge of at least one of the plurality of leads, the first material over more than fifty percent of the outer edge but less than one hundred percent of the outer edge of the least one of the plurality of leads.
An automobile, comprising:
- an engine compartment;
- a semiconductor component within the engine compartment, the semiconductor component comprising a semiconductor device coupled to an electrical interconnect structure, wherein the semiconductor device is embedded in a mold compound and the electrical interconnect structure is partially embedded in the mold compound, and wherein the electrical interconnect structure comprises a lead having an outer edge;
- and
- a first material comprising tin plated over more than fifty percent and less than one hundred percent of the outer edge of the lead.
1 more element
A method for manufacturing a semiconductor component, comprising:
- providing a semiconductor device coupled to one or more electrical interconnect structures partially embedded in a mold compound;
- sawing a trench into a portion of the one or more electrical interconnect structures and exposing a sidewall of the trench, wherein the trench sidewall extends a first distance into the portion of the one or more electrical interconnect structures, and wherein the first distance is less than the thickness of the one or more electrical interconnect structures and greater than fifty percent of the thickness of the one or more electrical interconnect structures;
- electroplating a first material over the exposed sidewall of the trench;
- and
- sawing completely through the trench and mold compound.
2 more elements
Dependencies are inferred from the claim text.