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US 2014/0151881 A1Published application
Packaged semiconductor chips with array
AssigneeTessera, Inc.
InventorsAndrey Grinman, David Ovrutsky, Charles Rosenstein, Vage Oganesian
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Abstract
A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.
Claims1
A chip-sized, wafer level packaged device comprising:
- a portion of a semiconductor wafer including a device;
- at least one packaging layer containing silicon and formed over said device;
- a first ball grid array formed over a surface of said at least one packaging layer and being electrically connected to said device;
- and
- a second ball grid array formed over a surface of said portion of said semiconductor wafer and being electrically connected to said device.
2 more elements
Dependencies are inferred from the claim text.