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AssigneesDisco Corporation, International Business Machines Corporation
InventorsRichard F. Indyk, Ian D. Melville, Shigefumi Okada
Estimating the term…
A substrate includes a plurality of semiconductor chips arranged in a grid pattern and laterally spaced from one another by channel regions. The substrate includes a vertical stack of a semiconductor layer and at least one dielectric material layer embedding metal interconnect structures. The at least one dielectric material layer are removed along the channel regions and around vertices of the grid pattern so that each semiconductor chip includes corner surfaces that are not parallel to lines of the grid pattern. The corner surfaces can include straight surfaces or convex surfaces. The semiconductor chips are diced and subsequently bonded to a packaging substrate employing an underfill material. The corner surfaces reduce mechanical stress applied to the metal interconnect layer during the bonding process and subsequent thermal cycling processes.
A method of manufacturing a semiconductor structure, said method comprising:
A semiconductor structure comprising a semiconductor chip, said semiconductor chip including a semiconductor substrate and at least one dielectric material layer that embeds metal interconnect structures, wherein said at least one dielectric material layer includes:
Dependencies are inferred from the claim text.