System and Method for Fine Pitch PoP Structure

A semiconductor device comprising:

• a first substrate, the first substrate having a first semiconductor die coupled thereto;
• a second substrate, the second substrate having a second semiconductor die coupled thereto;
• and
• a plurality of electrical connections electrically coupling the first substrate to the second substrate, each of electrical connections having an hourglass shape.

A semiconductor device comprising:

• a first substrate, the first substrate having a first semiconductor die coupled thereto;
• a second substrate, the second substrate having a second semiconductor die coupled thereto;
• and
• a plurality of electrical connections electrically coupling the first substrate to the second substrate, each of the electrical connections having a first region and a second region along the first substrate and the second substrate, respectively, the first region and the second region being wider than an intermediate region interposed between the first region and the second region.