Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsIsao OBU, Shinya OSAKABE
Life of this patent
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Abstract
A bump-equipped electronic component includes a circuit substrate and first and second bumps which are disposed on a principal surface of the circuit substrate and have different cross-sectional areas in a direction parallel or substantially parallel to the principal surface. One of the first and second bumps having a smaller cross-sectional area includes a height adjustment layer disposed in a direction perpendicular or substantially perpendicular to the principal surface.
Claims19
A bump-equipped electronic component comprising:
- a circuit substrate;
- and
- first and second bumps disposed on a principal surface of the circuit substrate and having different cross-sectional areas in a direction parallel or substantially parallel to the principal surface;
- wherein
- one of the first and second bumps having a smaller cross-sectional area includes a height adjustment layer disposed in a direction perpendicular or substantially perpendicular to the principal surface.
A bump-equipped electronic component comprising:
- a circuit substrate;
- and
- first and second bumps disposed on a principal surface of the circuit substrate and having different cross-sectional areas in a direction parallel or substantially parallel to the principal surface of the substrate;
- wherein
- each of the first and second bumps includes a height adjustment layer arranged to adjust a height from the principal surface of the substrate to a standard height.
A method for manufacturing a bump-equipped electronic component, the method comprising:
- a step of forming first and second bumps on a principal surface of a circuit substrate, the first and second bumps having different cross-sectional areas in a direction parallel or substantially parallel to the principal surface;
- wherein
- the step of forming the bumps includes a step of forming a height adjustment layer in a direction perpendicular or substantially perpendicular to the principal surface when one of the first and second bumps having a smaller cross-sectional area is formed.
Dependencies are inferred from the claim text.