Semiconductor device and semiconductor device manufacturing method

A manufacturing method of a semiconductor device, comprising:

• forming, on a first semiconductor chip having a plurality of concave and convex sections and bumps for bump bonding a second semiconductor chip formed on a surface side of the first semiconductor chip, a protruding section which straddles at least one convex section out of convex sections of the concave and convex sections formed in a surrounding section of a bonding region between the first semiconductor chip and the second semiconductor chip;
• bump bonding the first semiconductor chip and the second semiconductor chip together;
• and
• sealing a clearance between the first semiconductor chip and the second semiconductor chip by filling, with resin, a space between the bumps formed in accordance with the bump bonding by the bump bonding step, by injecting the resin from a prescribed position on the first semiconductor chip.