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US 2014/0151870 A1Published application
Semiconductor package including a heat-spreading part and method for its manufacture
OwnerDong-Kwan Kiminventor
Life of this patent
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Abstract
A semiconductor package includes a substrate, a semiconductor chip attached to an upper surface of the substrate, a molding material configured to surround side surfaces of the semiconductor chip, and a heat-spreading part disposed on the semiconductor chip. The heat-spreading part includes a thermal conductive film and a heat slug that are integrated together. Also provided is a method for its manufacture.
Claims16
A semiconductor package comprising:
- a substrate;
- a semiconductor chip attached to an upper surface of the substrate;
- a molding material surrounding side surfaces of the semiconductor chip;
- and
- a heat-spreading part disposed on the semiconductor chip,
- wherein the heat-spreading part comprises a heat slug and a thermal conductive film, the horizontal areas of which are substantially the same.
3 more elements
A semiconductor package comprising:
- a substrate;
- a semiconductor chip attached to an upper surface of the substrate;
- a molding material configured to surround side surfaces of the semiconductor chip;
- and
- a heat-spreading part disposed on the semiconductor chip, and including a thermal conductive film and a heat slug that are integrated together,
- wherein the heat-spreading part and a part of the molding material adjacent to the heat-spreading part comprise side surfaces aligned in a first vertical direction, and
- a remaining part of the molding material and the substrate comprises side surfaces aligned in a second vertical direction.
4 more elements
16-20. (canceled)
Dependencies are inferred from the claim text.