Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module

A method for producing a semiconductor module, the method comprising:

• providing a housing having two outer wall sections, a cover and a first shaft wall;
• providing a circuit carrier having a top side;
• providing a semiconductor chip;
• providing an electrically conductive first connection element;
• arranging the semiconductor chip, the circuit carrier, the housing and the first connection element relative to one another so that:
• the cover extends from one of the outer wall sections to the other one of the outer wall sections;
• the first shaft wall is arranged between and spaced apart from the outer wall sections and delimits a first shaft;
• the semiconductor chip is arranged in the housing on the top side of the circuit carrier;
• and
• the first connection element runs through the first shaft and extends out of the housing;
• filling a first potting compound into the interior of the housing and subsequently crosslinking the first potting compound so that the cross-linked first potting compound is arranged between the circuit carrier and the cover and partly between the first connection element and the first shaft wall and seals the first shaft in interaction with the first connection element, wherein the first shaft wall has at a side facing the circuit carrier a lower end dipping into the first potting compound;
• and
• filling a second potting compound into the interior of the housing after the first potting compound is cross-linked so that the second potting compound is arranged between the first potting compound and the cover and partly between the first connection element and the first shaft wall and seals the first shaft in interaction with the first connection element, and that at least one gas-filled volume region directly adjoining the first potting compound remains in the housing.