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US 2014/0151867 A1Published application
Semiconductor package and method for fabricating base for semiconductor package
AssigneeMediatek Inc.
InventorsTzu-Hung LIN, Wen-Sung HSU, Ta-Jen YU, Andrew C. CHANG
Life of this patent
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Abstract
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
Claims17
A semiconductor package, comprising:
- a conductive trace embedded in a base;
- and
- a semiconductor device mounted on the conductive trace via a conductive structure.
A semiconductor package, comprising:
- a conductive trace, having a bottom surface and at least a portion of a sidewall connected to a base;
- and
- a semiconductor device mounted on the conductive trace via a conductive structure.
Dependencies are inferred from the claim text.