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US 2014/0151866 A1Published application
Packaged Semiconductor Device with Tensile Stress and Method of Making a Packaged Semiconductor Device with Tensile Stress
AssigneeInfineon Technologies AG
InventorRalf Otremba
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Abstract
An assembled semiconductor device and a method of making an assembled semiconductor device are disclosed. In one embodiment the assembled device includes a carrier having a first thickness, a connection layer disposed on the carrier and a chip disposed on the connection layer, the chip having a second thickness, wherein the second thickness is larger than the first thickness.
Claims20
An assembled device comprising:
- a carrier comprising a first thickness;
- a connection layer disposed on the carrier;
- and
- a chip disposed on the connection layer, the chip comprising a second thickness,
- wherein the second thickness is larger than the first thickness.
2 more elements
An assembled device comprising:
- a carrier;
- a connection layer disposed on the carrier;
- and
- a planar chip comprising a top surface and a bottom surface, the planar chip being disposed with the bottom surface on the connection layer,
- wherein the top surface of the planar chip comprises a tensile stress.
2 more elements
An assembled device comprising:
- a carrier;
- a connection layer disposed on the carrier;
- and
- a chip comprising a top surface and a bottom surface, the chip being disposed with the bottom surface on the connection layer, the chip further comprising a first source/drain contact at the top surface and a second source/drain contact at the top surface,
- wherein the chip comprises a tensile stress between the first source/drain contact and the second source drain contact.
2 more elements
A method of manufacturing a semiconductor device, the method comprising:
- placing a semiconductor substrate with a bottom main surface onto a leadframe thereby forming a tensile stress at a top main surface of the semiconductor substrate, the leadframe comprising a larger thickness than the semiconductor substrate.
Dependencies are inferred from the claim text.