US 2014/0151863 A1 · SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

Abstract

A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.

Claims13

Dependent claims

A semiconductor package comprising:

a wiring board having a first surface and a second surface opposite to the first surface;
a semiconductor chip mounted on the first surface of the wiring board;
and
a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board, the mounting connection terminal including a core portion and a connecting shell solder portion substantially surrounding the core portion;
wherein the core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/064,106Filed 25 Oct 2013

Priority

KR 10-2012-013807730 Nov 2012

Published

5 Jun 2014

Term ends

Not estimatedThe source records don’t support an estimate.

Classification36 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10W 72/019
Manufacture or treatment: of bond pads
H10W 72/90
Interconnections or connectors in packages: bond pads, in general
H10W 74/012
Manufacture or treatment: of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills

Semiconductor packages and methods of fabricating the same

Life of this patent

Semiconductor packages and methods of fabricating the same

Life of this patent

Abstract

Claims13