Chip Module, an Insulation Material and a Method for Fabricating a Chip Module
AssigneeInfineon Technologies AG
InventorsRalf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess
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Abstract
The chip module includes a carrier, a semiconductor chip arranged on or embedded inside the carrier, and an insulation layer that at least partly covers a face of the carrier. The dielectric constant ∈r and the thermal conductivity λ of the insulation layer satisfy the condition λ·∈r<4.0 W·m−1·K−1.
Claims26
A chip module, comprising:
- a semiconductor chip;
- a carrier, wherein the semiconductor chip is arranged on or embedded inside the carrier;
- and
- an insulation layer at least partly covering a face of the carrier, wherein a dielectric constant ∈r and a thermal conductivity λ of the insulation layer satisfy the condition λ·∈r<4.0 W·m−1·K−1.
A chip module, comprising:
- a semiconductor chip;
- a carrier, wherein the semiconductor chip is arranged on or embedded inside the carrier;
- and
- an insulation layer at least partly covering a face of the carrier, wherein the insulation layer comprises porous material.
An insulation material having a dielectric constant ∈r and a thermal conductivity λ which satisfy the condition λ·∈r<4.0 W·m−1·K−1.
A substrate for carrying electrical components, the substrate comprising an insulation material having a dielectric constant ∈r and a thermal conductivity λ which satisfy the condition λ·∈r<4.0 W·m−1·K−1.
A method for fabricating a chip module, the method comprising:
- providing a carrier;
- providing a semiconductor chip;
- arranging the semiconductor chip on or embedding the semiconductor chip inside the carrier;
- providing an insulation material, wherein a dielectric constant ∈r and a thermal conductivity λ of the insulation material satisfy the condition λ·∈r<4.0 W·m−1·K−1;
- and
- applying the insulation material to form an insulation layer that at least partly covers a face of the carrier.
Dependencies are inferred from the claim text.