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US 2014/0151851 A1Published application
Tapered via and mim capacitor
AssigneeInternational Business Machines Corporation
InventorsJAMES STUART DUNN, ZHONG-XIANG HE, ANTHONY KENDALL STAMPER
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Abstract
A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit.
Claims8
1-13. (canceled)
A method comprising:
- selecting an insulating substrate having an upper surface and having a first wire in said insulating substrate;
- forming a first insulating layer over said upper surface of said insulating substrate and over said first wire;
- forming a first tapered opening in said first insulating layer over said first wire exposing said upper surface of said first wire;
- forming a bottom electrode of a capacitor on said first insulating layer;
- forming a first conductor over said upper surface of said first wire, said first tapered opening and said first insulating layer to said bottom electrode;
- forming a second insulating layer over said bottom electrode;
- and
- forming a top electrode of said capacitor on said second insulating layer positioned over said bottom electrode, said top electrode having a periphery interior of a periphery of said bottom electrode.
5 more elements
An apparatus comprising:
- an insulating substrate having an upper surface and having a first wire in said insulating substrate;
- a first insulating layer over said upper surface of said insulating substrate and over said first wire;
- a first tapered opening in said first insulating layer over said first wire exposing an upper surface of said first wire;
- a first conductor over said first tapered opening and in said upper surface of said first insulating layer to a bottom electrode of a capacitor, said bottom electrode in said first insulating layer;
- a second insulating layer over said bottom electrode;
- a top electrode of said capacitor on said second insulating layer positioned above said bottom electrode, said top electrode having a periphery interior of said bottom electrode;
- a third insulating layer over said second insulating layer and said top electrode;
- a second wire embedded in said third insulating layer positioned over said top electrode;
- and
- a plurality of vias formed in said third insulating layer extending from said second wire to said top electrode of said capacitor.
7 more elements
Dependencies are inferred from the claim text.