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US 2014/0151849 A1Published application
Electronic components on trenched substrates and method of forming same
AssigneeInternational Business Machines Corporation
InventorsDavid Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Abstract
An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.
Claims16
An electronic module, comprising:
- a substrate including at least one structure that reduces stress flow through the substrate, wherein said structure comprises at least one trench in a surface of the substrate;
- and
- a plurality of capacitor legs disposed on an upper surface of the substrate.
An electronic module, comprising:
- a substrate;
- an electronic component mounted above the substrate;
- a plurality of capacitor legs disposed on an upper surface of the substrate, the plurality of capacitor legs mounting the electronic component above the substrate;
- and
- at least one trench formed around the plurality of capacitor legs.
2 more elements
An electronic module, comprising:
- a substrate;
- and
- at least one trench in a surface of the substrate, said at least one trench being formed around a plurality of capacitor legs disposed on an upper surface of the substrate, said capacitor legs mounting an electronic component to the substrate.
Dependencies are inferred from the claim text.