Computer chip architecture

Abstract

A computer chip utilizing a hybrid metal gate wherein metal inserted poly silicon (MIPS) is used for nMOS and replacement metal gate (RMG) is used for pMOS, and wherein poly silicon doping over metal gates has been performed. The chip may be bombarded with boron isotopes or may have impurities added to dampen ringing noises. The chip may comprise a constituent material having characteristics of venting wells and distributed connections between layers. A highly reflective, stable metalloid agent may be bound to deposited metal layers. The constituent material may comprise a crystal having natural vacant states. The computer chip may comprise vertically stacked transistors. Vertical surface cavities located at metal junction points may serve as exhaust pipes.

Dependencies are inferred from the claim text.