FinFET DEVICE WITH DUAL-STRAINED CHANNELS AND METHOD FOR MANUFACTURING THEREOF
AssigneeImec
InventorsGeert Eneman, Benjamin Vincent, Voon Yew Thean
Life of this patent
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AssigneeImec
InventorsGeert Eneman, Benjamin Vincent, Voon Yew Thean
Estimating the term…
A FinFET device and a method for manufacturing a FinFET device is provided. An example device may comprise a substrate including at least two fin structures. Each of the at least two fin structures may be in contact with a source and drain region and each of the at least two fin structures may include a strain relaxed buffer (SRB) overlying and in contact with the substrate and an upper layer overlying and in contact with the SRB. The composition of the upper layer and the SRB may be selected such that the upper layer of a first fin structure is subjected to a first mobility enhancing strain in the as-grown state, the first mobility enhancing strain being applied in a longitudinal direction from the source region to the drain region and where at least an upper part of the upper layer of a second fin structure is strain-relaxed.
Method for manufacturing a dual channel FinFET device having at least one channel subjected to a mobility enhancement strain, the method comprising:
Method for manufacturing a dual channel FinFET device having each channel subjected to a mobility enhancement strain, the method comprising
The method according to 10, wherein the SRB1 comprises Si1-xGex, SRB2 comprises Si1-wCw and wherein each of the upper layer and the first upper layer comprises Si1-yGey, wherein y<x, 0<x<1, 0≦y<1, and 0<w≦0.1.
A dual channel FinFET device having at least one channel subjected to a mobility enhancement strain, the device comprising:
A dual channel FinFET device having each channel subjected to a mobility enhancement strain, the device comprising:
Dependencies are inferred from the claim text.