Solid-state imaging apparatus, manufacturing method thereof, and electronic information device
AssigneeSharp Kabushiki Kaisha
InventorTakefumi Konishi
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AssigneeSharp Kabushiki Kaisha
InventorTakefumi Konishi
Estimating the term…
The solid-state imaging apparatus 100a comprises: photoelectric conversion elements PD1 and PD2 formed within a semiconductor substrate 100; and transfer transistors Tt1 and Tt2 formed on a first main surface of the semiconductor substrate 100, for transferring the signal charge generated by the photoelectric conversion elements PD1 and PD2. The gate electrode 107 of each of the transfer transistors is configured to be disposed over a surface of a first main surface side of an electric charge accumulating region 102, which configures each of the photoelectric conversion elements. The gate electrode 107 is configured with a polysilicon gate layer 107a and a reflection film consisting of a high melting point metal silicide layer 107b for covering the surface of the polysilicon gate layer 107a. As a result, the improvement of sensitivity is achieved for the solid-state imaging apparatus.
A solid-state imaging apparatus comprising a photoelectric conversion element formed in a first conductivity type semiconductor substrate, for photoelectrically converting incident light to generate signal charges, in which the signal charges generated by the photoelectric conversion element are converted into an image signal by signal processing which is outputted,
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Dependencies are inferred from the claim text.