Semiconductor Construction, Semiconductor Unit, and Manufacturing Method Thereof

A semiconductor unit, comprising:

• a substrate having a first surface, a second surface, and at least one through hole;
• a patterned circuit layer disposed on the first surface, the second surface, and in all of the through holes, wherein the patterned circuit layer in the through hole is electrically connected to the patterned circuit layer on the first surface and the patterned circuit layer on the second surfaces;
• at least one chip disposed on the substrate and electrically connected to the patterned circuit layer;
• a filling material having a first part, a second part, and a third part, wherein the first part fills the through hole, the third part is located on the side of the substrate adjacent to the through hole, and the second part connects the first and the third parts;
• and
• a packaging material covering each of the chips and a part of the substrate.

A manufacturing method of a semiconductor structure, comprising:

• providing a substrate having a first surface in one side, a second surface in the reversed side, and at least one connecting channel;
• structuring at least one through hole in the substrate;
• forming an insulating layer on the first surface, the second surface, and the inner wall of each through hole;
• developing a patterned circuit layer on the insulating layer, wherein the patterned circuit layer is disposed on the first surface, the second surface, and in each of the through hole, the patterned circuit layer in the through hole is electrically connected to the patterned circuit layer on the first surface and the patterned circuit layer on the second surfaces;
• disposing the patterned circuit board on a carrier, wherein the patterned circuit layer on the first or second surface touches the carrier;
• implementing a filling process in the connecting channel, wherein a filling material is an insulating material and flows to the through hole from the connecting channel via the first or second surface, and then the filing material is cured;
• providing at least one chip, wherein each of the chips is electrically connected to the corresponding patterned circuit layer;
• and
• providing a packaging material covering each of the chips and a part of the substrate to form a semiconductor structure.